Copper ink for direct printing on circuit board ( pcb)
World highest conductivity 0.004 mohm/ sheet
low temperature sintering
TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE
Particle Size, μm <0.15
Average particle Size, µm D50 < 0.15, D90 < 5.0
Solids Content, after 30 minutes @ 150ºC, % 85-90
Density, g/ml 3.7
Viscosity @ 250C , DVEHA Brookfield spindle 14,
100rpm, mPa∙s (cps) 6000-8000
Theoretical coverage @ 8 µm dry film thickness, 12 m²/kg
Shelf Life @ -10°C, days 180
Flash Point – See SDS
Flash oint – See Safety Data Sheet (SDS)
Drying and Sintering:
Copper IF-370 may be dried employing dry hot air, (near) infrared or ceramic lamps.
Drying cycle: 15 sec @150°C (Ceramic lamps)
Sintering cycle: 5 sec @300°C (R2R laminator) or 5-30 sec @ 280-320°C (Heat press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.
TYPICAL PROPERTIES: CURED NANO COPPER PASTE
Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025
DIRECTIONS FOR NANO COPPER INK USE
Copper ink IF-370 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore
EQUIPMENT MAINTENANCE & CLEAN-UP
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.
STORAGE AND HANDLING
Store sealed container under -10°C in a dry location.
(Storage above 30°C can adver-10sely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions